Study of New Silicon Sensors for Experiments at Future Particle Colliders

In this work, two new technologies for future tracker detectors at future colliders are studied. In addition, the characterization techniques are described and the obtained results are presented. On one side, we studied two-dimensional position-sensitive microstrip sensors. This sensors use a resistive material as electrode instead of the standard metallic one. In this way, using a single sensor we can get information about two coordinates of a particle hit. On the other side, we studied double-sided double-type 3D pixel sensors. This sensors are manufactured in 3D technology instead of in the planar technology. They show more radiation hardness and require less energy to be efficiently operated than sensors manufactured in planar technology. With this work, we demonstrate the resistive microstrip sensors functionality as particle detector and the radiation hardness of 3D pixel detectors has been evaluated.