Soldering on silicon for microfluidic channels for cooling the high-energy physics detectors

Micro-channel cooling has been introduced as an important technique for cooling the electronics in the high-energy physics particle detectors. The silicon-etched microchannels containing the cooling fluids are connected to tubes that are made of metals at the ports. Those connections are made by soldering different metal components on the silicon. This report starts with a brief introduction of the metal semiconductor interface. It then discusses the problems that encounter soldering on silicon and the solutions that are present along with some examples. The importance of not using chemical flux in soldering and the preferred environment for soldering process is also examined. Moreover, the difference between soldering and brazing in addition to a recent example of brazing is provided.